Metallurgical and Materials Testing:
External Visual Inspection and Package Dimensions
Internal Visual Inspection
Routing and Polishing
Die Shear and Wire Bond Strength
Plating Thickness
Lead Fatigue
Scanning Electron Microscopy (SEM)
Energy Dispersive X-ray Analysis (EDX)
Particle Impact Noise Detection (PIND)
Radiography (X-Ray)
Scanning Acoustic Microscopy
Identification of Contaminants
Identification of Materials
Metallurgical Microsectioning Analysis of Materials
Plating Quality Assessment and Analysis
Plating Thickness Measurements
Cleanliness Testing of PC Assemblies (Ionography)
Corrosion Analysis
Tensile Strength (Instron)
Compression (Instron and MTS)
Internal Visual Inspection
Routing and Polishing
Die Shear and Wire Bond Strength
Plating Thickness
Lead Fatigue
Scanning Electron Microscopy (SEM)
Energy Dispersive X-ray Analysis (EDX)
Particle Impact Noise Detection (PIND)
Radiography (X-Ray)
Scanning Acoustic Microscopy
Identification of Contaminants
Identification of Materials
Metallurgical Microsectioning Analysis of Materials
Plating Quality Assessment and Analysis
Plating Thickness Measurements
Cleanliness Testing of PC Assemblies (Ionography)
Corrosion Analysis
Tensile Strength (Instron)
Compression (Instron and MTS)
